MESC - Mobile Electrostatic Carriers

We offer a variety of mobile electrostatic carriers to meet your process needs.
- MESC materials - Silicon, Quartz & Ceramic
- Bond time from 20 hours to more than 330 hours
- Capable of up to 450C thermal exposure (Note: reduced bond time w/high thermal exposure)
- 3000 cycles under standard conditions (refurbishment options available)
- 400v to 10,000v operating range
- Custom form factors available
- Sizes: 100mm, 150mm, 200mm, & 300mm

Applications
- Thin substrate handling
- Thin Si substrate with “bumped” contact surface
- Bridge – small substrate on large format carrier (ex. 4” wafer on 8” carrier)
- Transparent substrate

Approved Processes
- Lithography
- PR Coating on track
- PVD/PECVD (Low Temp)
- Plasma Etch
- Wafer thinning
- SEM
- Optical inspection
- Full emersion/wet etch (w/approved chemistrys)