MESC - Mobile Electrostatic Carriers

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We offer a variety of mobile electrostatic carriers to meet your process needs. 
  • MESC materials - Silicon, Quartz & Ceramic
  • Bond time from 20 hours to more than 330 hours
  • Capable of up to 450C thermal exposure (Note: reduced bond time w/high thermal exposure)
  • 3000 cycles under standard conditions (refurbishment options available)
  • 400v to 10,000v operating range
  • Custom form factors available
  • Sizes: 100mm, 150mm, 200mm, & 300mm
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Applications
  • Thin substrate handling 
  • Thin Si substrate with “bumped” contact surface
  • Bridge – small substrate on large format carrier (ex. 4” wafer on 8” carrier)
  • Transparent substrate
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Approved Processes
  • Lithography 
  • PR Coating on track
  • PVD/PECVD (Low Temp)  
  • Plasma Etch
  • Wafer thinning 
  • SEM
  • Optical inspection
  • Full emersion/wet etch (w/approved chemistrys)